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HIGH GAIN CATV POWER DOUBLER AMPLIFIER
FEATURES
* GALLIUM ARSENIDE ACTIVE DEVICES * HIGH GAIN/LOW DISTORTION MC-7842: 22 dB Linear Gain MC-7843: 24 dB Linear Gain * LOW DC CURRENT DRAW 375 mA MAX DC Current (360 TYP) * LOW GAIN CHANGE OVER TEMP 0.5 dB TYP change from -30 to +100C * HIGH RELIABILITY/RUGGEDNESS Withstands environmental extremes as well as Silicon devices (surge, ESD, etc.) * INDUSTRY COMPATIBLE PACKAGE
MC-7842 MC-7843
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
45.08 MAX 38.10.25 3.2 MAX 27.5 MAX 4.25
+ 0.25 - 0.35
14.85 MAX 4.00.25 8.1 MAX 19.050.38 1 In 6-32 unc 2B
VDD 5 9 Out
25.40.25 2.540.25
2378 0.510.05 21.5 MAX Gnd
12.9 MAX
123 5
789
2.620.35
DESCRIPTION
The MC-7842 and MC-7843 are GaAs hybrid integrated circuits designed to be used as the output stage in CATV cable distribution amplifier applications up to 870 MHz. The only difference between the MC-7842 and the MC-7843 is gain of about 22 dB and 24 dB respectively. With this product, NEC has made significant advancements to their initial power doubler product offering, including lower distortion, higher crash point, less variation in gain over temperature, a reduction in out of band gain at the high end, and improved ability to survive an overdrive. Like the previous products, these devices survive such hazards as surge and ESD as well as their sili4.190.13 A 0.38.. A 0.510.05
10.75 0.25
2.54 0.38 6.3 2.5
0.05
con competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality and process control procedures. Both parts come in industry compatible hybrid packages.
ELECTRICAL CHARACTERISTICS (TCASE = 30C, VDD = 24 V, ZS = ZL = 75 )
SYMBOLS BW GL S Gf NF IDD CTB X-Mod CSO RL in/out PART NUMBER PARAMETERS Frequency Range Linear Gain Gain Slope Gain Flatness Noise Figure Operating Current, PIN = none Composite Triple Beat Distortion Cross Modulation1 Composite Second Order Distortion Input/Output Return Loss UNITS MHz dB dB dB dB dB dB dBc dBc dBc dB dB dB dB MIN 50 22.0 0.3 - - - 275 - - - 20.0 19.0 17.5 16.0 -64 -60 -66 - - - - MC-7842 TYP - - 0.9 - - - MAX 870 23.5 1.5 1.0 6.3 6.8 375 -60 -55 -63 - - - - MIN 50 24.0 0.3 - - - 275 - - - 20.0 19.0 17.5 16.0 -64 -60 -66 - - - - MC-7843 TYP - - 0.9 - - - MAX 870 25.5 1.5 1.0 6.0 6.5 375 -60 -55 -63 - - - - 110 channels, Vout = +50dBmV, at 745.25 MHz, 10dB tilted across the band. 40 to 160 MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz f = 870 MHz 50 to 870 MHz 50 to 870 MHz; Peak to Valley 50 MHz 870 MHz CONDITIONS
Note: 1. Measured per US standard methods and procedures (using selective level meter).
California Eastern Laboratories
MC-7842, MC-7843 ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 C)
SYMBOLS VDD Vi TC TSTG PARAMETERS Supply Voltage Input Voltage2 Operating Case Temperature Storage Temperature UNITS V dBmV C C RATINGS 30 65 -30 to +100 -40 to +100 TC
RECOMMENDED OPERATING CONDITIONS
(ZS= ZL= 75) SYMBOLS VDD Vi PARAMETERS Supply Voltage Input Voltage1 MC-7842 MC-7843 Operating Case Temperature UNITS V dBmV dBmV C MIN 23.5 - - -30 TYP MAX 24.0 24.5 27.0 31.5 25.0 29.5 +25 +85
Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance.
Note: 1. Test Condition: 110 channels, 10 dB tilted across the band.
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering Method Pin Part Heating Soldering Conditions Pin area temperature: less than 260C1 Hour: Within 2 sec./pin Condition Symbol -
Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES * Headquarters * 4590 Patrick Henry Drive * Santa Clara, CA 95054-1817 * (408) 988-3500 * Telex 34-6393 * FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) * Internet: http://WWW.CEL.COM 07/10/2002 DATA SUBJECT TO CHANGE WITHOUT NOTICE

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